Hwang, Jennie S. <br/><br/>
Solder Paste in Electronics Packaging Technology and Applications in Surface Mount Hybrid Circuits and Component Assembly  

 - New York :   Van Nostrand Reinhold,   c1992 
 - XXII, 456 p.  : ill 
<br/><br/>Includes Bibliographical References and Index 
<br/><br/><label>ISBN: </label>0442207549 
<br/><br/><label>ISSN: </label>
<br/><br/><label>Subjects--Topical Terms: </label><br/>Printed Circuits Design and Construction<br/>Solder Pastes<br/>Surface Mount Technology
<br/><br/><label>Dewey Class. No.: </label>621.381531  / HWA