Pb-Free Sn/3.5 Ag Electroplating Bumping Process and Under Bump Metallization (Ubm)

By: Material type: ArticleArticleDescription: 193-202 pSubject(s): In: Ieee Transactions onElectronics Packaging Manufacturing
Holdings
Item type Current library Call number Vol info Status Date due Barcode
Articles Articles Periodical Section Vol.25, No.03 (Jul. 2002) Available