Thermal Stability of Sputtered Copper Films Containing Dilute Insoluble Tungsten: Thermal Anealing Study

By: Material type: ArticleArticleDescription: 1429-1434 pSubject(s): In: Journal of Materials Research
Holdings
Item type Current library Call number Vol info Status Date due Barcode
Articles Articles Periodical Section Vol.18, No.06 (Jun. 2003) Available