Package Clock Distribution Design Optimization for High-Speed and Low-Power Vlsi'S

By: Material type: ArticleArticleDescription: 56-63 pSubject(s): In: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging
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Item type Current library Call number Vol info Status Date due Barcode
Articles Articles Periodical Section Vol.20, No.01 (Feb. 1997) Available