The Development of Component-Level Thermal Compact Models of a C4/Cbga Interconnect TechnologyMotorola Power Pc 603and Power 604 Risc Microprocessors

By: Material type: ArticleArticleDescription: 104-112 pSubject(s): In: IEEE Transactions on Components Packaging and Manufacturing Technology Part A
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Articles Articles Periodical Section Vol.21, No.01 (Mar. 1998) Available