Materials for Information Technology Devices Interconnects and Packaging

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Language: English Series: Engineering Materials and ProcessesPublication details: London : Springer-Verlag, c2005Description: XIX, 508 p. : illISBN:

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Holdings
Item type	Current library	Shelving location	Call number	Status	Date due	Barcode	Item holds
Lending Collection	Circulation Section	Circulation Section	621.3815 ZSC	Available		80466

Total holds: 0