Entry Topical Term

Number of records used in: 3

001 - CONTROL NUMBER

• control field: 768423

003 - CONTROL NUMBER IDENTIFIER

• control field: NEDUET

005 - DATE AND TIME OF LATEST TRANSACTION

• control field: 20230819161223.0

008 - FIXED-LENGTH DATA ELEMENTS

• fixed length control field: 230819|| aca||aabn | a|a d

040 ## - CATALOGING SOURCE

• Original cataloging agency: NEDUET
• Transcribing agency: NEDUET

150 ## - HEADING--TOPICAL TERM

• Topical term or geographic name entry element: Diffusion Barriers

670 ## - SOURCE DATA FOUND

• Source citation: Work cat.: (NEDUET)740335: Chen, Chun-Jen 768421, Electroless Ni Cu P Barrier Between Si/Ti/Al Pad and Sn-Pb Flip-Chip Solder Bumps