Entry Personal Name

Number of records used in: 6

001 - CONTROL NUMBER

• control field: 768417

003 - CONTROL NUMBER IDENTIFIER

• control field: NEDUET

005 - DATE AND TIME OF LATEST TRANSACTION

• control field: 20230819161223.0

008 - FIXED-LENGTH DATA ELEMENTS

• fixed length control field: 230819|| aca||aabn | a|a d

040 ## - CATALOGING SOURCE

• Original cataloging agency: NEDUET
• Transcribing agency: NEDUET

100 ## - HEADING--PERSONAL NAME

• Personal name: Chan, Philip C. H

670 ## - SOURCE DATA FOUND

• Source citation: Work cat.: (NEDUET)740333: Xiao, Guo-Wei 768415, Effect of Cu Stud Microstructure and Electroplating Process on Intermetalilc Compounds Growth and Reliability of Flip Chip Solder Bump