Assembly of Lead-Free Bumped Flip-Chip with No-Flow Underfills (Record no. 770594)

MARC details
000 -LEADER
fixed length control field 00484nab a2200145Ia 4500
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 230808s2002 |||||||f |||| 00| 0 eng d
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Zhang, Zhuquing
9 (RLIN) 766315
245 #0 - TITLE STATEMENT
Title Assembly of Lead-Free Bumped Flip-Chip with No-Flow Underfills
300 ## - PHYSICAL DESCRIPTION
Extent 113-119 p.
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Flip Chi P
9 (RLIN) 773702
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Lead-Free Solder
9 (RLIN) 756437
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Material Properties
9 (RLIN) 172216
773 ## - HOST ITEM ENTRY
Place, publisher, and date of publication 2002
Title Ieee Transactions onElectronics Packaging Manufacturing
International Standard Serial Number 1523334X
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type Articles
-- 51
-- ABUL KALAM Library
Holdings
Not for loan Home library Serial Enumeration / chronology Total Checkouts Date last seen Koha item type
  Engr Abul Kalam Library Vol.25, No.02 (Apr. 2002)   19/08/2023 Articles