Assembly of Lead-Free Bumped Flip-Chip with No-Flow Underfills (Record no. 770594)
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000 -LEADER | |
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fixed length control field | 00484nab a2200145Ia 4500 |
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
fixed length control field | 230808s2002 |||||||f |||| 00| 0 eng d |
100 ## - MAIN ENTRY--PERSONAL NAME | |
Personal name | Zhang, Zhuquing |
9 (RLIN) | 766315 |
245 #0 - TITLE STATEMENT | |
Title | Assembly of Lead-Free Bumped Flip-Chip with No-Flow Underfills |
300 ## - PHYSICAL DESCRIPTION | |
Extent | 113-119 p. |
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
Topical term or geographic name entry element | Flip Chi P |
9 (RLIN) | 773702 |
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
Topical term or geographic name entry element | Lead-Free Solder |
9 (RLIN) | 756437 |
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
Topical term or geographic name entry element | Material Properties |
9 (RLIN) | 172216 |
773 ## - HOST ITEM ENTRY | |
Place, publisher, and date of publication | 2002 |
Title | Ieee Transactions onElectronics Packaging Manufacturing |
International Standard Serial Number | 1523334X |
942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
Koha item type | Articles |
-- | 51 |
-- | ABUL KALAM Library |
Not for loan | Home library | Serial Enumeration / chronology | Total Checkouts | Date last seen | Koha item type |
---|---|---|---|---|---|
Engr Abul Kalam Library | Vol.25, No.02 (Apr. 2002) | 19/08/2023 | Articles |