An Experimental Investigation Into Soft-Pad Grinding of Wire-Sawn Silicon Wafers (Record no. 756334)

MARC details
000 -LEADER
fixed length control field 00520nab a2200145Ia 4500
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 230808s2004 |||||||f |||| 00| 0 eng d
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Pei, Z J
9 (RLIN) 801227
245 #3 - TITLE STATEMENT
Title An Experimental Investigation Into Soft-Pad Grinding of Wire-Sawn Silicon Wafers
300 ## - PHYSICAL DESCRIPTION
Extent 299-306 p.
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Grinding
9 (RLIN) 52491
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Machining Steel
9 (RLIN) 801228
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Material Removal
9 (RLIN) 798985
773 ## - HOST ITEM ENTRY
Place, publisher, and date of publication 2004
Title International Journal of Machine tools & Manufacture: Design, Research and Application
International Standard Serial Number 08906955
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type Articles
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-- ABUL KALAM Library
Holdings
Not for loan Home library Serial Enumeration / chronology Total Checkouts Date last seen Koha item type
  Engr Abul Kalam Library Vol.44, No.2-3 (Feb. 2004)   19/08/2023 Articles