Mechanism of Electromigration in Ceramic Packages Induced by Chip-Coating Polyimide (Record no. 749241)

MARC details
000 -LEADER
fixed length control field 00553nab a2200157Ia 4500
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 230808s1990 |||||||f |||| 00| 0 eng d
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Mashiko, Youji
9 (RLIN) 789438
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Kohara, Masanobu
9 (RLIN) 789440
245 #0 - TITLE STATEMENT
Title Mechanism of Electromigration in Ceramic Packages Induced by Chip-Coating Polyimide
300 ## - PHYSICAL DESCRIPTION
Extent 873-878 p.
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Mechanism
9 (RLIN) 82265
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Electromigration
9 (RLIN) 777428
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Ceramic Packages
9 (RLIN) 788852
773 ## - HOST ITEM ENTRY
Place, publisher, and date of publication 1990
Title IEEE Transactions on Components Hybrids and Manufacturing Technology
International Standard Serial Number 01486411
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type Articles
-- 51
-- ABUL KALAM Library
Holdings
Not for loan Home library Serial Enumeration / chronology Total Checkouts Date last seen Koha item type
  Engr Abul Kalam Library Vol.13, No.04 (Dec. 1990)   19/08/2023 Articles