Evaluation of Polyimides as Dielectric Materials for Multichip Packages with Multilevel Interconnection Structure (Record no. 749064)

MARC details
000 -LEADER
fixed length control field 00539nab a2200145Ia 4500
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 230808s1990 |||||||f |||| 00| 0 eng d
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name lin, A.W.
9 (RLIN) 788745
245 #0 - TITLE STATEMENT
Title Evaluation of Polyimides as Dielectric Materials for Multichip Packages with Multilevel Interconnection Structure
300 ## - PHYSICAL DESCRIPTION
Extent 207-213 p.
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Evaluation
9 (RLIN) 18641
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Polyimides
9 (RLIN) 713759
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Dielectric Materials
9 (RLIN) 107410
773 ## - HOST ITEM ENTRY
Place, publisher, and date of publication 1990
Title IEEE Transactions on Components Hybrids and Manufacturing Technology
International Standard Serial Number 01486411
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type Articles
-- 51
-- ABUL KALAM Library
Holdings
Not for loan Home library Serial Enumeration / chronology Total Checkouts Date last seen Koha item type
  Engr Abul Kalam Library Vol.13, No.01 (Mar. 1990)   19/08/2023 Articles