Wetting Interactions BetweenNi-Cu-P Deposit and In-Sn Solders (Record no. 746065)

MARC details
000 -LEADER
fixed length control field 00562nab a2200157Ia 4500
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 230808s1997 |||||||f |||| 00| 0 eng d
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Chen, Chun-Jen
9 (RLIN) 768421
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name lin, Kwang Lung
9 (RLIN) 768422
245 #0 - TITLE STATEMENT
Title Wetting Interactions BetweenNi-Cu-P Deposit and In-Sn Solders
300 ## - PHYSICAL DESCRIPTION
Extent 211-216 p.
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Activation Energy
9 (RLIN) 680774
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Wetting
9 (RLIN) 58007
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Solder Reliability
9 (RLIN) 780080
773 ## - HOST ITEM ENTRY
Place, publisher, and date of publication 1997
Title IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging
International Standard Serial Number 10709894
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type Articles
-- 51
-- ABUL KALAM Library
Holdings
Not for loan Home library Serial Enumeration / chronology Total Checkouts Date last seen Koha item type
  Engr Abul Kalam Library Vol.20, No.03 (Aug. 1997)   19/08/2023 Articles