Wetting Interactions BetweenNi-Cu-P Deposit and In-Sn Solders (Record no. 746065)
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000 -LEADER | |
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fixed length control field | 00562nab a2200157Ia 4500 |
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
fixed length control field | 230808s1997 |||||||f |||| 00| 0 eng d |
100 ## - MAIN ENTRY--PERSONAL NAME | |
Personal name | Chen, Chun-Jen |
9 (RLIN) | 768421 |
100 ## - MAIN ENTRY--PERSONAL NAME | |
Personal name | lin, Kwang Lung |
9 (RLIN) | 768422 |
245 #0 - TITLE STATEMENT | |
Title | Wetting Interactions BetweenNi-Cu-P Deposit and In-Sn Solders |
300 ## - PHYSICAL DESCRIPTION | |
Extent | 211-216 p. |
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
Topical term or geographic name entry element | Activation Energy |
9 (RLIN) | 680774 |
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
Topical term or geographic name entry element | Wetting |
9 (RLIN) | 58007 |
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
Topical term or geographic name entry element | Solder Reliability |
9 (RLIN) | 780080 |
773 ## - HOST ITEM ENTRY | |
Place, publisher, and date of publication | 1997 |
Title | IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging |
International Standard Serial Number | 10709894 |
942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
Koha item type | Articles |
-- | 51 |
-- | ABUL KALAM Library |
Not for loan | Home library | Serial Enumeration / chronology | Total Checkouts | Date last seen | Koha item type |
---|---|---|---|---|---|
Engr Abul Kalam Library | Vol.20, No.03 (Aug. 1997) | 19/08/2023 | Articles |