Fatigue life Studies on Defect-Free Solder Joints Fabricated from Modified Reflow Soldering (Record no. 742777)

MARC details
000 -LEADER
fixed length control field 00608nab a2200169Ia 4500
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 230808s1996 |||||||f |||| 00| 0 eng d
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Xie, D
9 (RLIN) 677292
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Chan, Yan C.
9 (RLIN) 774424
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Lai, J. K. L.
9 (RLIN) 774674
245 #0 - TITLE STATEMENT
Title Fatigue life Studies on Defect-Free Solder Joints Fabricated from Modified Reflow Soldering
300 ## - PHYSICAL DESCRIPTION
Extent 679-684 p.
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Fatigue
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Solder-Joint Inspection
9 (RLIN) 768094
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Soldering
9 (RLIN) 52709
773 ## - HOST ITEM ENTRY
Place, publisher, and date of publication 1996
Title IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging
International Standard Serial Number 10709894
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type Articles
-- 51
-- ABUL KALAM Library
Holdings
Not for loan Home library Serial Enumeration / chronology Total Checkouts Date last seen Koha item type
  Engr Abul Kalam Library Vol.19, No.03 (Aug. 1996)   19/08/2023 Articles