A Study of Electromigration in 3-D Flip Chip Solder Joint Using Numerical Simulation of Heat Flux and Current Density (Record no. 742650)

MARC details
000 -LEADER
fixed length control field 00622nab a2200169Ia 4500
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 230808s2004 |||||||f |||| 00| 0 eng d
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Lee, Tien-Yu
9 (RLIN) 774422
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Lee, Taek Jung
9 (RLIN) 728391
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Tu, King-Ning
9 (RLIN) 774425
245 #2 - TITLE STATEMENT
Title A Study of Electromigration in 3-D Flip Chip Solder Joint Using Numerical Simulation of Heat Flux and Current Density
300 ## - PHYSICAL DESCRIPTION
Extent 472-479 p.
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Computation Fluid Dynamics
9 (RLIN) 723704
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Current Density
9 (RLIN) 686093
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Flip-Chip
9 (RLIN) 765290
773 ## - HOST ITEM ENTRY
Place, publisher, and date of publication 2004
Title IEEE Transactions on Components and Packaging Technologies
International Standard Serial Number 15213331
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type Articles
-- 51
-- ABUL KALAM Library
Holdings
Not for loan Home library Serial Enumeration / chronology Total Checkouts Date last seen Koha item type
  Engr Abul Kalam Library Vol.27, No.03 (Sep. 2004)   19/08/2023 Articles