A Study of Electromigration in 3-D Flip Chip Solder Joint Using Numerical Simulation of Heat Flux and Current Density (Record no. 742650)
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000 -LEADER | |
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fixed length control field | 00622nab a2200169Ia 4500 |
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
fixed length control field | 230808s2004 |||||||f |||| 00| 0 eng d |
100 ## - MAIN ENTRY--PERSONAL NAME | |
Personal name | Lee, Tien-Yu |
9 (RLIN) | 774422 |
100 ## - MAIN ENTRY--PERSONAL NAME | |
Personal name | Lee, Taek Jung |
9 (RLIN) | 728391 |
100 ## - MAIN ENTRY--PERSONAL NAME | |
Personal name | Tu, King-Ning |
9 (RLIN) | 774425 |
245 #2 - TITLE STATEMENT | |
Title | A Study of Electromigration in 3-D Flip Chip Solder Joint Using Numerical Simulation of Heat Flux and Current Density |
300 ## - PHYSICAL DESCRIPTION | |
Extent | 472-479 p. |
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
Topical term or geographic name entry element | Computation Fluid Dynamics |
9 (RLIN) | 723704 |
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
Topical term or geographic name entry element | Current Density |
9 (RLIN) | 686093 |
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
Topical term or geographic name entry element | Flip-Chip |
9 (RLIN) | 765290 |
773 ## - HOST ITEM ENTRY | |
Place, publisher, and date of publication | 2004 |
Title | IEEE Transactions on Components and Packaging Technologies |
International Standard Serial Number | 15213331 |
942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
Koha item type | Articles |
-- | 51 |
-- | ABUL KALAM Library |
Not for loan | Home library | Serial Enumeration / chronology | Total Checkouts | Date last seen | Koha item type |
---|---|---|---|---|---|
Engr Abul Kalam Library | Vol.27, No.03 (Sep. 2004) | 19/08/2023 | Articles |