Cracking Failures in Lead-on Chip Packages Induced by Chip Backside Contamination (Record no. 742315)

MARC details
000 -LEADER
fixed length control field 00607nab a2200169Ia 4500
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 230808s1995 |||||||f |||| 00| 0 eng d
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Amagai, Masazumi
9 (RLIN) 773514
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Ebe, Kazuyoshi
9 (RLIN) 773515
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Seno, Hideo
9 (RLIN) 773517
245 #0 - TITLE STATEMENT
Title Cracking Failures in Lead-on Chip Packages Induced by Chip Backside Contamination
300 ## - PHYSICAL DESCRIPTION
Extent 119-126 p.
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Wafer
9 (RLIN) 712604
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Adhesive
9 (RLIN) 693759
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Package Modeling
9 (RLIN) 767703
773 ## - HOST ITEM ENTRY
Place, publisher, and date of publication 1995
Title IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging
International Standard Serial Number 10709894
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type Articles
-- 51
-- ABUL KALAM Library
Holdings
Not for loan Home library Serial Enumeration / chronology Total Checkouts Date last seen Koha item type
  Engr Abul Kalam Library Vol.18, No.01 (Feb. 1995)   19/08/2023 Articles