Formation and Growth Kinetics of Interfacial Intermetalilcs in Pb-Free Solder Joint (Record no. 741747)

MARC details
000 -LEADER
fixed length control field 00547nab a2200157Ia 4500
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 230808s2003 |||||||f |||| 00| 0 eng d
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name li, G.
9 (RLIN) 736917
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Chen, B. L.
9 (RLIN) 772080
245 #0 - TITLE STATEMENT
Title Formation and Growth Kinetics of Interfacial Intermetalilcs in Pb-Free Solder Joint
300 ## - PHYSICAL DESCRIPTION
Extent 651-658 p.
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Intermetalilc Compound
9 (RLIN) 711237
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Lead-Ffree
9 (RLIN) 765909
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Solder Joint Reliability
9 (RLIN) 755390
773 ## - HOST ITEM ENTRY
Place, publisher, and date of publication 2003
Title IEEE Transactions on Components and Packaging Technologies
International Standard Serial Number 15213331
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type Articles
-- 51
-- ABUL KALAM Library
Holdings
Not for loan Home library Serial Enumeration / chronology Total Checkouts Date last seen Koha item type
  Engr Abul Kalam Library Vol.26, No.03 (Sep. 2003)   19/08/2023 Articles