Exothermic Reaction Induced Eutectic Pb-Sn Solder Bali Melting InUnderfili Curing Process (Record no. 741400)

MARC details
000 -LEADER
fixed length control field 00590nab a2200169Ia 4500
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 230808s2004 |||||||f |||| 00| 0 eng d
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Kwon, Woon-Seong
9 (RLIN) 771194
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Jang, Se-Young
9 (RLIN) 771196
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Paik, Kyung-Wook
9 (RLIN) 768099
245 #0 - TITLE STATEMENT
Title Exothermic Reaction Induced Eutectic Pb-Sn Solder Bali Melting InUnderfili Curing Process
300 ## - PHYSICAL DESCRIPTION
Extent 172-174 p.
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Exotherm
9 (RLIN) 771198
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Flip Chip
9 (RLIN) 765290
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Solder Bali Reliability
9 (RLIN) 768068
773 ## - HOST ITEM ENTRY
Place, publisher, and date of publication 2004
Title IEEE Transactions on Components and Packaging Technologies
International Standard Serial Number 15213331
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type Articles
-- 51
-- ABUL KALAM Library
Holdings
Not for loan Home library Serial Enumeration / chronology Total Checkouts Date last seen Koha item type
  Engr Abul Kalam Library Vol.27, No.01 (Mar. 2004)   19/08/2023 Articles