Effect of Cu Stud Microstructure and Electroplating Process on Intermetalilc Compounds Growth and Reliability of Flip Chip Solder Bump (Record no. 740333)

MARC details
000 -LEADER
fixed length control field 00610nab a2200169Ia 4500
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 230808s2001 |||||||f |||| 00| 0 eng d
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Xiao, Guo-Wei
9 (RLIN) 768415
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Chan, Philip C. H.
9 (RLIN) 768417
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Cai, Jian
9 (RLIN) 168666
245 #0 - TITLE STATEMENT
Title Effect of Cu Stud Microstructure and Electroplating Process on Intermetalilc Compounds Growth and Reliability of Flip Chip Solder Bump
300 ## - PHYSICAL DESCRIPTION
Extent 682-690 p.
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Copper
9 (RLIN) 163065
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Electroplating
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Flip-Chip
9 (RLIN) 765290
773 ## - HOST ITEM ENTRY
Place, publisher, and date of publication 2001
Title IEEE Transactions on Components and Packaging Technologies
International Standard Serial Number 15213331
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type Articles
-- 51
-- ABUL KALAM Library
Holdings
Not for loan Home library Serial Enumeration / chronology Total Checkouts Date last seen Koha item type
  Engr Abul Kalam Library Vol.24, No.04 (Oct. 2001)   19/08/2023 Articles