Investigation OfUnderfili Delamination and Cracking in Filp Chip Modules Under Temperature Cyclic Loading (Record no. 740210)

MARC details
000 -LEADER
fixed length control field 00549nab a2200157Ia 4500
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 230808s2001 |||||||f |||| 00| 0 eng d
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Fan, X-J.
9 (RLIN) 768085
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name lim, T. B.
9 (RLIN) 768086
245 #0 - TITLE STATEMENT
Title Investigation OfUnderfili Delamination and Cracking in Filp Chip Modules Under Temperature Cyclic Loading
300 ## - PHYSICAL DESCRIPTION
Extent 84-91 p.
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Cracking
9 (RLIN) 169262
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Delamination
9 (RLIN) 170371
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Finite - Element Analysis
773 ## - HOST ITEM ENTRY
Place, publisher, and date of publication 2001
Title IEEE Transactions on Components and Packaging Technologies
International Standard Serial Number 15213331
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type Articles
-- 51
-- ABUL KALAM Library
Holdings
Not for loan Home library Serial Enumeration / chronology Total Checkouts Date last seen Koha item type
  Engr Abul Kalam Library Vol.24, No.01 (Mar. 2001)   19/08/2023 Articles