Development of No-Flow Underfili Materials for Lead-Free Solder Bumped Flip-Chip Applications (Record no. 740207)

MARC details
000 -LEADER
fixed length control field 00572nab a2200169Ia 4500
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 230808s2001 |||||||f |||| 00| 0 eng d
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Zhang, Z
9 (RLIN) 753718
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Shi, S. H.
9 (RLIN) 768080
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Wong, C. P.
9 (RLIN) 93201
245 #0 - TITLE STATEMENT
Title Development of No-Flow Underfili Materials for Lead-Free Solder Bumped Flip-Chip Applications
300 ## - PHYSICAL DESCRIPTION
Extent 59-66 p.
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Epoxy Resin
9 (RLIN) 170487
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Flip Chip
9 (RLIN) 765290
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Lead-Free Solder
9 (RLIN) 756437
773 ## - HOST ITEM ENTRY
Place, publisher, and date of publication 2001
Title IEEE Transactions on Components and Packaging Technologies
International Standard Serial Number 15213331
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type Articles
-- 51
-- ABUL KALAM Library
Holdings
Not for loan Home library Serial Enumeration / chronology Total Checkouts Date last seen Koha item type
  Engr Abul Kalam Library Vol.24, No.01 (Mar. 2001)   19/08/2023 Articles