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Interconnection Parameter Extraction of Printed Circuit Board By Hybrid Measurements of Tdr and S-Parameter

Kim, Yong-Ju Kim, Young-Hee Wee, Jae-Kyung

Interconnection Parameter Extraction of Printed Circuit Board By Hybrid Measurements of Tdr and S-Parameter - 969-969 p.

Subjects--Topical Terms:
Microwave Technology

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