Integration and Reliability of Cu-Sioc Interconnect for Arf/90-Nm Node Cmos Technology
Noguchi, Junji Oshima, Takayuki
Integration and Reliability of Cu-Sioc Interconnect for Arf/90-Nm Node Cmos Technology - 2168-2174 p.
Copper
Dielectric Breakdown
Electromigration
Integration and Reliability of Cu-Sioc Interconnect for Arf/90-Nm Node Cmos Technology - 2168-2174 p.
Copper
Dielectric Breakdown
Electromigration