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An Innovative Bonding Technique for Optical Chips Using Solder Bumps That Eliminate Chip Positioning Adjustments

Hayashi, Tsuyoshi

An Innovative Bonding Technique for Optical Chips Using Solder Bumps That Eliminate Chip Positioning Adjustments - 225-230 p.

Subjects--Topical Terms:
Optoelectronic
Innovative Design
Solder Bump Radius

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