Normal view MARC view ISBD view

Advanced Ceramic Substrates for Multichip Modules with Multilevel Thin Film Interconnects

Tormey, Elien S. Bachner, Frank J. Foster, Brian C.

Advanced Ceramic Substrates for Multichip Modules with Multilevel Thin Film Interconnects - 784-789 p.

Subjects--Topical Terms:
Advanced Ceramics
Multichip Modules
Multilevel Systems

Print
Request article
Suggest for purchase
Send to device
Save record
BIBTEX Dublin Core ISBD MARCXML RIS
More searches

Search for this title in:
Other Databases (Google Scholar) Open Library (openlibrary.org) Pakistan Union Catalogue (pastic.gov.pk) Other Libraries (WorldCat)